Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D633079 | Media player | — | 2011-02-22 |
| 7688971 | Network telephone expansion seat | Chang-Hsiung Lee, Yi Tang | 2010-03-30 |
| D552549 | Switch | — | 2007-10-09 |
| D545768 | Switch | — | 2007-07-03 |
| D537820 | Storage device | — | 2007-03-06 |
| D530314 | Gateway | — | 2006-10-17 |
| D530316 | Switch hub | Ya-Chyi Chou | 2006-10-17 |
| D529477 | Telephone | — | 2006-10-03 |
| D522520 | Storage device | — | 2006-06-06 |
| 7009847 | Connector concealment mechanism for computer peripheral device | Kuo-Chang Wu, Yi-Min Tseng, Hsin-Chiang Ho, Ya-Chyi Chou | 2006-03-07 |
| 6482675 | Substrate strip for use in packaging semiconductor chips and method for making the substrate strip | Shih-Chang Lee, Wei-Chun Kung | 2002-11-19 |
| 6462421 | Multichip module | Su Tao | 2002-10-08 |
| 6380002 | Method for fabricating a flexible substrate based ball grid array (BGA) package | Shih-Chang Lee | 2002-04-30 |
| 6338813 | Molding method for BGA semiconductor chip package | Chun-Hung Lin, Tao-Yu Chen | 2002-01-15 |
| 6316828 | Structure of a solder mask for the circuit module of a BGA substrate | Su Tao, Tao-Yu Chen | 2001-11-13 |
| 6291271 | Method of making semiconductor chip package | Chun-Chi Lee | 2001-09-18 |
| 6271057 | Method of making semiconductor chip package | Chun-Chi Lee | 2001-08-07 |
| 6262490 | Substrate strip for use in packaging semiconductor chips | Shih-Chang Lee, Wei-Chun Kung | 2001-07-17 |
| 6242815 | Flexible substrate based ball grid array (BGA) package | Shih-Chang Lee | 2001-06-05 |