Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7005327 | Process and structure for semiconductor package | Liamh-Cheng Chang | 2006-02-28 |
| 6482675 | Substrate strip for use in packaging semiconductor chips and method for making the substrate strip | Kao-Yu Hsu, Shih-Chang Lee | 2002-11-19 |
| 6262490 | Substrate strip for use in packaging semiconductor chips | Kao-Yu Hsu, Shih-Chang Lee | 2001-07-17 |