Issued Patents All Time
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929733 | Connection propagation for inter-logical block connections in integrated circuits | Pratyush Kamal, Kambiz Samadi, Jing Xie | 2018-03-27 |
| 9922956 | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | Je-Hsiung Lan, Wenyue Zhang, Yong Ju Lee, Shiqun Gu, Jing Xie | 2018-03-20 |
| 9869713 | Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems | Sung Kyu Lim, Ratibor Radojcic | 2018-01-16 |
| 9773741 | Bondable device including a hydrophilic layer | Shiqun Gu, William Xia | 2017-09-26 |
| 9754923 | Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Jing Xie, Kambiz Samadi, Pratyush Kamal, Javid Jaffari | 2017-09-05 |
| 9741691 | Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) | Sung Kyu Lim, Kambiz Samadi | 2017-08-22 |
| 9712168 | Process variation power control in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Giby Samson, Yu Pu | 2017-07-18 |
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Sung Kyu Lim, Karamvir CHATHA, Kambiz Samadi | 2017-04-18 |
| 9628077 | Dual power swing pipeline design with separation of combinational and sequential logics | Jing Xie | 2017-04-18 |
| 9583473 | Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology | — | 2017-02-28 |
| 9583179 | Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICs), 3DIC processor cores, and methods | Jing Xie | 2017-02-28 |
| 9578762 | Television monitor combination stand and wall mount | Timothy M. Cassidy, He Kaizuan | 2017-02-21 |
| 9543383 | High-speed high-power semiconductor devices | Vladimir Aparin, Robert P. Gilmore | 2017-01-10 |
| 9536840 | Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods | — | 2017-01-03 |
| 9508615 | Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits | Sung Kyu Lim, Kambiz Samadi, Pratyush Kamal | 2016-11-29 |
| 9483598 | Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits | Sung Kyu Lim, Kambiz Samadi | 2016-11-01 |
| 9418985 | Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology | — | 2016-08-16 |
| 9343369 | Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems | Karim Arabi | 2016-05-17 |
| 9321007 | Blends of amines with piperazine for CO2 capture | Gary Rochelle, Omkar A. Namjoshi, Le Li, Thu Nguyen | 2016-04-26 |
| 9256246 | Clock skew compensation with adaptive body biasing in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Sung Kyu Lim | 2016-02-09 |
| 9213358 | Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cross-tier clock skew management systems, methods and related components | Pratyush Kamal | 2015-12-15 |
| 9177890 | Monolithic three dimensional integration of semiconductor integrated circuits | — | 2015-11-03 |
| 9171608 | Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICS), 3DIC processor cores, and methods | Jing Xie | 2015-10-27 |
| 9147438 | Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods | Pratyush Kamal, Kambiz Samadi | 2015-09-29 |
| 9123721 | Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace | Kambiz Samadi, Shreepad Amar Panth, Pratyush Kamal | 2015-09-01 |