Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111242 | One-dimensional soil column test apparatus for seepage and internal erosion in geotechnical centrifuge | Bo-Ying Huang, Chang Guo, Linfeng Cao, Yao TANG, Yu Zhao +1 more | 2024-10-08 |
| 12106025 | Method for designing squeezed branch pile based on orthogonal design and finite element analysis | Cunbao Zhao, Ziqi Wang | 2024-10-01 |
| 11621209 | Semiconductor device thermal bump | Lei Ma, Antonino Scuderi, William Clinton Burling PEATMAN | 2023-04-04 |
| 9922956 | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | Je-Hsiung Lan, Yang Du, Yong Ju Lee, Shiqun Gu, Jing Xie | 2018-03-20 |
| 8922974 | MEMS varactors | Je-Hsiung Lan, Evgeni Gousev, Manish Kothari, Sang-June Park | 2014-12-30 |
| 8363380 | MEMS varactors | Je-Hsiung Lan, Evgeni Gousev, Manish Kothari, Sang-June Park | 2013-01-29 |