Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621209 | Semiconductor device thermal bump | Lei Ma, Wenyue Zhang, Antonino Scuderi | 2023-04-04 |
| 6821829 | Method of manufacturing a semiconductor component and semiconductor component thereof | Eric S. Johnson, Adolfo C. Reyes | 2004-11-23 |