Issued Patents All Time
Showing 176–200 of 241 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9083300 | Electromechanical systems piezoelectric contour mode differential resonators and filters | Chi Shun Lo, Sang-June Park, Sanghoon Joo, Chengjie Zuo, Changhan Hobie Yun | 2015-07-14 |
| 9020530 | Location tracking of mobile phone using GPS function | Moon J. Kim, Jean-Oliver Plouchart | 2015-04-28 |
| 9013310 | Circuit structure and method of fabrication for facilitating radio frequency identification (RFID) | Choongyeun Cho, Daeik Daniel Kim, Moon J. Kim | 2015-04-21 |
| 9008602 | Radio frequency switch for diversity receiver | Chengjie Zuo, Changhan Hobie Yun, Chi Shun Lo, Mario Francisco Velez | 2015-04-14 |
| 9001031 | Complex passive design with special via implementation | Chi Shun Lo, Je-Hsiung Lan, Mario Francisco Velez, Robert Paul Mikulka, Chengjie Zuo +1 more | 2015-04-07 |
| 8987976 | Piezoelectric resonator having combined thickness and width vibrational modes | Chengjie Zuo, Chi Shun Lo, Sanghoon Joo, Changhan Hobie Yun | 2015-03-24 |
| 8988130 | Method and apparatus for providing through silicon via (TSV) redundancy | Feng Wang, Matthew Michael Nowak | 2015-03-24 |
| 8970516 | Integrated passives and power amplifier | Justin Phelps Black, Ravindra V. Shenoy, Evgeni Gousev, Aristotele Hadjichristos, Thomas Andrew Myers +3 more | 2015-03-03 |
| 8937355 | Striped on-chip inductor | Choongyeun Cho, Daeik Daniel Kim, Moon J. Kim, Jean-Olivier Plouchart, Robert E. Trzcinski | 2015-01-20 |
| 8907450 | Metal-semiconductor wafer bonding for high-Q devices | Changhan Hobie Yun, Chengjie Zuo, Chi Shun Lo, Mario Francisco Velez | 2014-12-09 |
| 8889522 | High breakdown voltage embedded MIM capacitor structure | Woo-Tag Kang | 2014-11-18 |
| 8816567 | Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppression | Chengjie Zuo, Changhan Hobie Yun, Chi Shun Lo | 2014-08-26 |
| 8803648 | Three-dimensional multilayer solenoid transformer | Chi Shun Lo, Chengjie Zuo, Changhan Hobie Yun | 2014-08-12 |
| 8723646 | Acoustic wave and radio frequency identification device and method | Choongyeun Cho, Richard Ferri, Daeik Daniel Kim, Moon J. Kim | 2014-05-13 |
| 8717118 | Transformer signal coupling for flip-chip integration | Feng Wang, Matthew Michael Nowak | 2014-05-06 |
| 8704428 | Widening resonator bandwidth using mechanical loading | Changhan Hobie Yun, Chengjie Zuo, Chi Shun Lo, Sanghoon Joo | 2014-04-22 |
| 8627021 | Method and apparatus for load-based prefetch access | Feng Wang | 2014-01-07 |
| 8618629 | Apparatus and method for through silicon via impedance matching | Jeong Hwan Yang, Matthew Michael Nowak | 2013-12-31 |
| 8604586 | High breakdown voltage embedded MIM capacitor structure | Wootag Kang | 2013-12-10 |
| 8578193 | Apparatus, method and program product for adaptive real-time power and perfomance optimization of multi-core processors | Daeik Daniel Kim, Moon J. Kim, James R. Moulic | 2013-11-05 |
| 8518464 | Method and system for manufacturing whole soy milk | Michael Kim | 2013-08-27 |
| 8508301 | Three dimensional inductor, transformer and radio frequency amplifier | Shiqun Gu, Brian Matthew Henderson, Thomas R. Toms, Lew G. Chua-Eoan, Seyfollah Bazarjani +1 more | 2013-08-13 |
| 8492874 | High density metal-insulator-metal trench capacitor | Je-Hsiung Lan, Matthew Michael Nowak, Evgeni Gousev, Clarence Chui | 2013-07-23 |
| 8471643 | Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation | Je-Hsiung Lan, Changhan Hobie Yun, Chi Shun Lo, Matthew Michael Nowak | 2013-06-25 |
| 8451581 | Passive coupler between package substrate and system board | Arvind Chandrasekaran | 2013-05-28 |