Issued Patents All Time
Showing 51–75 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121718 | Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer | Dirk Robert Walter Leipold, Baker Scott, George Maxim | 2018-11-06 |
| 10109550 | Wafer-level package with enhanced performance | Jonathan Hale Hammond, Jan Edward Vandemeer, Merrill Albert Hatcher, Jr., Jon Chadwick | 2018-10-23 |
| 10109548 | Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer | Dirk Robert Walter Leipold, Baker Scott, George Maxim | 2018-10-23 |
| 10109502 | Semiconductor package with reduced parasitic coupling effects and process for making the same | George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2018-10-23 |
| 10103080 | Thermally enhanced semiconductor package with thermal additive and process for making the same | George Maxim, Dirk Robert Walter Leipold, Baker Scott, Merrill Albert Hatcher, Jr., Stephen Mobley | 2018-10-16 |
| 10090339 | Radio frequency (RF) switch | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2018-10-02 |
| 10090262 | Microelectronics package with inductive element and magnetically enhanced mold compound component | George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2018-10-02 |
| 10085352 | Method for manufacturing an integrated circuit package | George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2018-09-25 |
| 10079196 | Thermally enhanced semiconductor package having field effect transistors with back-gate feature | George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2018-09-18 |
| 10068831 | Thermally enhanced semiconductor package and process for making the same | Robert Aigner | 2018-09-04 |
| 10062637 | Method of manufacture for a semiconductor device | David M. Shuttleworth, Michael J. Antonell | 2018-08-28 |
| 10062583 | Microelectronics package with inductive element and magnetically enhanced mold compound component | George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2018-08-28 |
| 10038055 | Substrate structure with embedded layer for post-processing silicon handle elimination | Jan Edward Vandemeer | 2018-07-31 |
| 10020405 | Microelectronics package with integrated sensors | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2018-07-10 |
| 10020206 | Encapsulated dies with enhanced thermal performance | Thomas Scott Morris, David Jandzinski, Stephen Parker, Jon Chadwick | 2018-07-10 |
| 9960145 | Flip chip module with enhanced properties | Thomas Scott Morris, Jonathan Hale Hammond, David Jandzinski, Stephen Parker, Jon Chadwick | 2018-05-01 |
| 9911836 | Vertical ballast technology for power HBT device | Michael Carroll | 2018-03-06 |
| 9892879 | Encapsulated micro-electromechanical system switch and method of manufacturing the same | Jonathan Hale Hammond | 2018-02-13 |
| 9859076 | Encapsulated micro-electromechanical system switch and method of manufacturing the same | Jonathan Hale Hammond | 2018-01-02 |
| 9824951 | Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same | Dirk Robert Walter Leipold, Baker Scott | 2017-11-21 |
| 9812350 | Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer | — | 2017-11-07 |
| 9806192 | Suppression of back-gate transistors in RF CMOS switches built on an SOI substrate | Philip W. Mason, Michael Carroll, Jan Edward Vandemeer, Daniel Charles Kerr | 2017-10-31 |
| 9613831 | Encapsulated dies with enhanced thermal performance | Thomas Scott Morris, David Jandzinski, Stephen Parker, Jon Chadwick | 2017-04-04 |
| 9583414 | Silicon-on-plastic semiconductor device and method of making the same | David M. Shuttleworth, Michael J. Antonell | 2017-02-28 |
| 9530709 | Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2016-12-27 |