Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9770783 | Method for measuring the distance between a workpiece and a machining head of a laser machining apparatus | Markus Kogel-Hollacher, Thibault Bautze | 2017-09-26 |
| 9230817 | Apparatus and method for monitoring a thickness of a silicon wafer with a highly doped layer | Christoph Dietz | 2016-01-05 |
| 8716039 | Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring the thinning of semiconductor wafers and thinning apparatus comprising a wet etching apparatus and a monitoring apparatus | Claus Dusemund, Berthold Michelt, Christoph Dietz | 2014-05-06 |
| 8699038 | Apparatus and method for monitoring a thickness of a silicon wafer with a highly doped layer | Christoph Dietz | 2014-04-15 |