Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11219967 | Machining head for a laser machining device | Markus Kogel-Hollacher | 2022-01-11 |
| 11079218 | Measuring distance using a laser processing system with optical amplifier for amplifying measuring beam or reflected part of measurement beam | Rüdiger Moser | 2021-08-03 |
| 11027364 | Method and device for measuring the depth of the vapor capillary during a machining process with a high-energy beam | Christoph Dietz | 2021-06-08 |
| 10967452 | Device for measuring the depth of a weld seam in real time | Rüdiger Moser, Thibault Bautze | 2021-04-06 |
| 10731965 | Phosphor light source for CLS or multipoint | — | 2020-08-04 |
| 10444521 | Device for machining material by means of laser radiation | Andreas Rudolf | 2019-10-15 |
| 10260941 | Chromatic confocal distance sensor | David Marsaut | 2019-04-16 |
| 10234265 | Distance measuring device and method for measuring distances | Stephan Andre | 2019-03-19 |
| 10228551 | Device and method for optically measuring a measurement object | Christoph Dietz, Jean-Francois Pichot | 2019-03-12 |
| 9982994 | Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head | Berthold Michelt, Matthias Kunkel | 2018-05-29 |
| 9677871 | Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head | Berthold Michelt, Matthias Kunkel | 2017-06-13 |
| 9494409 | Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer | Berthold Michelt | 2016-11-15 |
| 9297645 | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer | — | 2016-03-29 |
| 8982339 | Material-working device with in-situ measurement of the working distance | Markus Kogel-Hollacher | 2015-03-17 |