Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094654 | Package structure and method of manufacturing the same | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2021-08-17 |
| 11088100 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2021-08-10 |
| 11088080 | Chip package structure using silicon interposer as interconnection bridge | Pei-Chun Tsai, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2021-08-10 |
| 11009748 | Display device | Jia Li | 2021-05-18 |
| 10978408 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2021-04-13 |
| 10950593 | Package structure including at least one connecting module and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2021-03-16 |
| 10840200 | Manufacturing method of chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2020-11-17 |
| 10796931 | Manufacturing method of package structure | Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2020-10-06 |
| 10756065 | Method thereof of package structure | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2020-08-25 |
| 10629559 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2020-04-21 |
| 10629554 | Package structure and manufacturing method thereof | Hung-Hsin Hsu | 2020-04-21 |
| 10593647 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2020-03-17 |
| 10522512 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2019-12-31 |
| 10515936 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2019-12-24 |
| 10438931 | Package structure and manufacturing method thereof | Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2019-10-08 |
| 10381278 | Testing method of packaging process and packaging structure | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2019-08-13 |
| 10332844 | Manufacturing method of package structure | Hung-Hsin Hsu | 2019-06-25 |
| 10304716 | Package structure and manufacturing method thereof | Hsing-Te Chung, Yong-Cheng Chuang, Kuo-Ting Lin | 2019-05-28 |
| 10276526 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2019-04-30 |
| 10269671 | Package structure and manufacturing method thereof | Hung-Hsin Hsu | 2019-04-23 |
| 10177011 | Chip packaging method by using a temporary carrier for flattening a multi-layer structure | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2019-01-08 |
| 10163834 | Chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2018-12-25 |
| 10157828 | Chip package structure with conductive pillar and a manufacturing method thereof | Hung-Hsin Hsu | 2018-12-18 |
| 10141276 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2018-11-27 |
| 10079218 | Test method for a redistribution layer | Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang-Chien | 2018-09-18 |