Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094809 | Chip-middle type fan-out panel-level package and packaging method thereof | Hiroyuki Fujishima | 2024-09-17 |
| 11670611 | Semiconductor package comprising plurality of bumps and fabricating method | Hung-Hsin Hsu, Nan-Chun Lin | 2023-06-06 |
| 10079218 | Test method for a redistribution layer | Han-Wen Lin, Hung-Hsin Hsu, Nan-Chun Lin | 2018-09-18 |
| 10002848 | Test method for a redistribution layer | Han-Wen Lin, Hung-Hsin Hsu, Nan-Chun Lin | 2018-06-19 |