Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806751 | Wafer level ultrasonic device and manufacturing method thereof | Hung-Ping Lee | 2023-11-07 |
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Huan Liu, Hung-Ping Lee +1 more | 2023-02-28 |
| 11548031 | Array-type ultrasonic sensor | Hung-Ping Lee | 2023-01-10 |
| 11478822 | Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Huan Liu, Hung-Ping Lee +1 more | 2022-10-25 |
| 11460341 | Wafer scale ultrasonic sensor assembly and method for manufacturing the same | Yu Jin, Sheng-Lin Ma, Hung-Ping Lee, Dan Gong | 2022-10-04 |
| 11130674 | Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same | Sheng-Lin Ma, Dan Gong | 2021-09-28 |
| 11075072 | Wafer scale ultrasonic sensing device and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Huan Liu, Hung-Ping Lee +1 more | 2021-07-27 |
| 10657349 | Ultrasonic module and method for manufacturing the same | Yu Jin, Sheng-Lin Ma, Qian Zhao, Huan Liu | 2020-05-19 |
| 8318526 | Manufacturing method for light-sensing structure | Siew-Seong Tan, Jen-Chieh Chen | 2012-11-27 |