Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608550 | Hot working die steel with high thermal strength and high toughness and manufacturing process thereof | Qingchun Zhou, Weiming Xu, Jincai Gu, Jianhui Ge, Bowei Zhao +1 more | 2023-03-21 |
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Yu Jin, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2023-02-28 |
| 11478822 | Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof | Yu Jin, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2022-10-25 |
| 11460341 | Wafer scale ultrasonic sensor assembly and method for manufacturing the same | Yu Jin, Yi-Hsiang Chiu, Hung-Ping Lee, Dan Gong | 2022-10-04 |
| 11130674 | Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same | Dan Gong, Yi-Hsiang Chiu | 2021-09-28 |
| 11075072 | Wafer scale ultrasonic sensing device and manufacturing method thereof | Yu Jin, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2021-07-27 |
| 10657349 | Ultrasonic module and method for manufacturing the same | Yu Jin, Qian Zhao, Huan Liu, Yi-Hsiang Chiu | 2020-05-19 |