Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806751 | Wafer level ultrasonic device and manufacturing method thereof | Yi-Hsiang Chiu | 2023-11-07 |
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu +1 more | 2023-02-28 |
| 11548031 | Array-type ultrasonic sensor | Yi-Hsiang Chiu | 2023-01-10 |
| 11478822 | Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu +1 more | 2022-10-25 |
| 11460341 | Wafer scale ultrasonic sensor assembly and method for manufacturing the same | Yu Jin, Sheng-Lin Ma, Yi-Hsiang Chiu, Dan Gong | 2022-10-04 |
| 11075072 | Wafer scale ultrasonic sensing device and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu +1 more | 2021-07-27 |
| 10120634 | LED display device | — | 2018-11-06 |