Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11821929 | Quasi-real-time data collection system and method for competitive power market | Chao Zhou, Shuangshuang Zhao, Meimei Duan, Xiao Chen, Qing Xu +5 more | 2023-11-21 |
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu +1 more | 2023-02-28 |
| 11478822 | Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu +1 more | 2022-10-25 |
| 11460341 | Wafer scale ultrasonic sensor assembly and method for manufacturing the same | Yu Jin, Sheng-Lin Ma, Yi-Hsiang Chiu, Hung-Ping Lee | 2022-10-04 |
| 11130674 | Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same | Sheng-Lin Ma, Yi-Hsiang Chiu | 2021-09-28 |
| 11075072 | Wafer scale ultrasonic sensing device and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu +1 more | 2021-07-27 |