Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711496 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-07-18 |
| 9711421 | Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of GATE-snake-open-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-07-18 |
| 9691672 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-06-27 |
| 9653446 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and AA-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-05-16 |
| 9646961 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and metal-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-05-09 |
| 9627371 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and AA-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-04-18 |
| 9627370 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-04-18 |
| 7078817 | Multiple copper vias for integrated circuit metallization | Paul S. Ho, Ki-Don Lee, Ennis T. Ogawa | 2006-07-18 |
| 6919639 | Multiple copper vias for integrated circuit metallization and methods of fabricating same | Paul S. Ho, Ki-Don Lee, Ennis T. Ogawa | 2005-07-19 |
| 6495461 | Process for forming amorphous titanium silicon nitride on substrate | Kazuo Tsubouchi, Kazuya Masu | 2002-12-17 |