Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure and method to minimize warpage of packaged semiconductor devices

Structure and method to minimize warpage of packaged semiconductor devices

US Patent 9978614 · Granted May 22, 2018

Estimated economic value: $10,145,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conduit inserts for encapsulant compound formulation kneading and encapsulation 2025
Packaged semiconductor device assembly2024
Packaged semiconductor device assembly2024
Conduit inserts for encapsulant compound formulation kneading and encapsulation 2023
Package with conductive underfill ground plane2022
Package with conductive underfill ground plane2022
Hybrid package2021
Hybrid package2021
Package with support structure2019
Package with support structure2019
Surface finish for wirebonding2019
Die attachment for packaged semiconductor device2019