{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Channelization for dispersion limited waveguide communication channels", "item": "https://www.patentleaderboard.com/patent/9960849"}]}
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Home › Channelization for dispersion limited waveguide communication channels

Channelization for dispersion limited waveguide communication channels

US Patent 9960849 · Granted May 1, 2018

Estimated economic value: $34,156,000 ⓘ

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