Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for producing a structure by assembling at least two elements by direct adhesive bonding

Process for producing a structure by assembling at least two elements by direct adhesive bonding

US Patent 9922953 · Granted Mar 20, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Functionalized object with integrated mechanical wave sensor and associated prod2025
Method for sealing cavities using membranes2025
Device for locking and/or unlocking a motor vehicle opening panel, vehicle compr2024
Composite structure, intended for a planar co-integration of electronic componen2024
Method for the production of a bulk acoustic wave resonator with a reduced paras2023
Touch surface device2022
Method for transferring a useful layer into a supporting substrate2022
Method for transferring a thin layer using a filled preceramic polymer2022
Optoelectronic device manufacturing method2022
SOI substrate compatible with the RFSOI and FDSOI technologies2021
Method for transferring structures2021
Assembly for 3D circuit with superposed transistor levels2021