Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etch stop liner for contact punch through mitigation in SOI substrate

Etch stop liner for contact punch through mitigation in SOI substrate

US Patent 9899257 · Granted Feb 20, 2018

Estimated economic value: $9,359,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Epitaxial structures of semiconductor devices that are independent of local patt2021
Self-aligned single diffusion break for fully depleted silicon-on-insulator and 2020
Diffusion break forming after source/drain forming and related IC structure2018
Methods for providing variable feature widths in a self-aligned spacer-mask patt2018
Methods for providing variable feature widths in a self-aligned spacer-mask patt2018
Multi-layered integrated circuit with selective temperature coefficient of resis2016
Method for embedded diamond-shaped stress element2016
FinFET formation with late fin reveal2015
Semiconductor device and method of making same2015
Overlapping contacts for semiconductor device2015
Static random access memory test structure2014
Semiconductor device manufacturing methods2014