{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Electronic device comprising an encapsulating block locally of smaller thickness", "item": "https://www.patentleaderboard.com/patent/9818664"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic device comprising an encapsulating block locally of smaller thickness

Electronic device comprising an encapsulating block locally of smaller thickness

US Patent 9818664 · Granted Nov 14, 2017

Estimated economic value: $10,071,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing a cover for an electronic package and electronic packag2023
Method for manufacturing an encapsulation cover for an electronic package and el2021
Method for manufacturing a cover for an electronic package and electronic packag2020
Method for making a cover for an electronic package and electronic package compr2019
Method for manufacturing an encapsulation cover for an electronic package and el2019
Electronic device comprising an encapsulating block locally of smaller thickness2019
Electronic device comprising an encapsulating block locally of smaller thickness2019
Method for collective (wafer-scale) fabrication of electronic devices and electr2018
Dual side package on package2015
Process for producing electrical-connections on a semiconductor package, and sem2003
Process for producing electrical connections on the surface of a semiconductor p2002
Casing for integrated circuit chips and method of fabrication2000