{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Casing for integrated circuit chips and method of fabrication", "item": "https://www.patentleaderboard.com/patent/6049971"}]}
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Home › Casing for integrated circuit chips and method of fabrication

Casing for integrated circuit chips and method of fabrication

US Patent 6049971 · Granted Apr 18, 2000

Estimated economic value: $51,439,000 ⓘ

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