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Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

US Patent 9768144 · Granted Sep 19, 2017

Estimated economic value: $3,647,000 ⓘ

Assignee

Disney

Inventors

Albert Wu (108 patents)
Roawen Chen (13 patents)
Chung Chyung Han (14 patents)
Shiann-Ming Liou (74 patents)
Chien-Chuan Wei (25 patents)
Runzi Chang (66 patents)
Scott Wu (125 patents)
Chuan-Cheng Cheng (29 patents)

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