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Home › Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP

US Patent 9679824 · Granted Jun 13, 2017

Assignee

Stats Chippac

Inventors

Reza A. Pagaila (192 patents)
Rajendra D. Pendse (146 patents)
Jun Mo Koo (43 patents)

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