Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › IC device having patterned, non-conductive substrate

IC device having patterned, non-conductive substrate

US Patent 9646853 · Granted May 9, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with bond wire reinforcement structure2021
Substrate interconnections for packaged semiconductor device2018
Universal BGA substrate2017
Substrate for alternative semiconductor die configurations2016
Semiconductor package with stress relief and heat spreader2015
Semiconductor package with stress relief and heat spreader2015
Semiconductor device with die attached heat spreader2015
Semiconductor device with die attached heat spreader2015
Mold cap for semiconductor device2015
Mold cap for semiconductor device2015
Lead frame for semiconductor package with enhanced stress relief2014
Semiconductor sensor device with over-molded lid2014