Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device

Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device

US Patent 9633890 · Granted Apr 25, 2017

Estimated economic value: $23,712,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Distribution system for a process fluid for chemical and/or electrolytic surface2025
Distribution body for a process fluid for chemical and/or electrolytic surface t2025
Distribution system for a process fluid for chemical and/or electrolytic surface2025
Substrate handling device for a wafer2025
Substrate holding and locking system for chemical and/or electrolytic surface tr2024
Substrate holding and locking system for chemical and/or electrolytic surface tr2024
Module for chemically processing a substrate2024
Clipping mechanism for fastening a substrate for a surface treatment of the subs2024
Clipping mechanism for fastening a substrate for a surface treatment of the subs2024
Method and device for plating a recess in a substrate2024
Method and device for plating a recess in a substrate2024
Wafer cleaning method and apparatus therefore2023