{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure", "item": "https://www.patentleaderboard.com/patent/9620455"}]}

Home › Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

US Patent 9620455 · Granted Apr 11, 2017

Assignee

Stats Chippac

Inventors

Reza A. Pagaila (192 patents)
Yaojian Lin (300 patents)
Jun Mo Koo (43 patents)

View full patent text on Google Patents →