Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)

Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)

US Patent 9611138 · Granted Apr 4, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low cost wafer level process for packaging MEMS three dimensional devices2019
Low cost wafer level process for packaging MEMS three dimensional devices2019
Single wafer fabrication process for wavelength dependent reflectance for linear2012
Single wafer fabrication process for wavelength dependent reflectance for linear2012
Compact atomic magnetometer and gyroscope based on a diverging laser beam2011