Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10167190 | Low cost wafer level process for packaging MEMS three dimensional devices | Andrei A. Shkel, Doruk Senkal | 2019-01-01 |
| 9611138 | Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS) | Andrei A. Shkel | 2017-04-04 |