Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication

Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication

US Patent 9610615 · Granted Apr 4, 2017

Estimated economic value: $2,991,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical mechanical polishing apparatus and method2025
Chemical mechanical polishing apparatus and method2025
Platen rotation device2024
Sputter target magnet2024
Chemical-mechanical polishing system and method2023
System for cleaning wafer in CMP process of semiconductor manufacturing fabricat2022
System for cleaning wafer in CMP process of semiconductor manufacturing fabricat2022
Sputter target magnet2022
Platen rotation method2021
System for cleaning wafer in CMP process of semiconductor manufacturing fabricat2020
System for cleaning wafer in CMP process of semiconductor manufacturing fabricat2020
Platen rotation system and method2020