Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of dicing a wafer and semiconductor chip

Method of dicing a wafer and semiconductor chip

US Patent 9570352 · Granted Feb 14, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip separation supported by back side trench and adhesive therein2025
Semiconductor chip having a crack stop structure2025
Semiconductor device and method for manufacturing a plurality of semiconductive 2025
Semiconductor device and method for manufacturing a plurality of semiconductive 2025
System for producing a cast film, and film stretching installation with such a s2024
Carrier arrangement and method for processing a carrier by generating a crack st2020
Carrier arrangement and method for processing a carrier by generating a crack st2020
Methods for forming a semiconductor device and semiconductor devices2020
Wafer and method for processing a wafer2020
Method of separating semiconductor dies from a semiconductor substrate, semicond2019
Wafer and method for processing a wafer2018
Removal of a reinforcement ring from a wafer2018