Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer and method for processing a wafer

Wafer and method for processing a wafer

US Patent 10090214 · Granted Oct 2, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip separation supported by back side trench and adhesive therein2025
Semiconductor chip having a crack stop structure2025
Semiconductor chip having a crack stop structure2025
Semiconductor device and method for manufacturing a plurality of semiconductive 2025
Carrier arrangement and method for processing a carrier by generating a crack st2020
Wafer and method for processing a wafer2020
Wafer and method for processing a wafer2020
Wafer and method for processing a wafer2020
System and method for integrated inductor2018
Method of dicing a wafer and semiconductor chip2018
Methods for manufacturing a chip arrangement, methods for manufacturing a chip p2017
Method of dicing a wafer and semiconductor chip2017