Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3D device packaging using through-substrate posts

3D device packaging using through-substrate posts

US Patent 9515006 · Granted Dec 6, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plated pillar dies having integrated electromagnetic shield layers2023
Packaged integrated circuit having a photodiode and a resistive memory2022
Magnetic attack detection in a magnetic random access memory (MRAM)2021
Semiconductor manufacturing using disposable test circuitry within scribe lanes2020
Semiconductor package with embedded capacitor and methods of manufacturing same2019
Post contact air gap formation2019
Post contact air gap formation2019
Method of forming inter-level dielectric structures on semiconductor devices2019
Method of forming inter-level dielectric structures on semiconductor devices2019
Semiconductor device with graphene encapsulated metal and method therefor2019
Semiconductor device with graphene encapsulated metal and method therefor2019
Multigate transistor2018