Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites

High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites

US Patent 9512291 · Granted Dec 6, 2016

Estimated economic value: $2,582,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Assay for filtration of suspended particles in microporous membranes2025
Zero-index photonic crystals for visible and near infrared applications2025
Ex situ coating of chamber components for semiconductor processing2025
Ex situ coating of chamber components for semiconductor processing2024
System for heating and cooling system with stand-alone modular units2024
Hydronic system and method for heating and cooling a building2024
Assay for filtration of suspended particles in microporous membranes2024
Multi chip hardware security module2024
Oxidation resistant protective layer in chamber conditioning2023
Mitigating moisture-driven degradation of features designed to prevent structura2023
Ex situ coating of chamber components for semiconductor processing2022
Laminated stiffener to control the warpage of electronic chip carriers2022