Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedded die-down package-on-package device

Embedded die-down package-on-package device

US Patent 9455218 · Granted Sep 27, 2016

Estimated economic value: $16,083,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical interconnect design for improved electrical performance2025
Integrated bridge frame for package substrate2025
Recessed vertical interconnects for device miniaturization2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Semiconductor package with hybrid mold layers2025
Hybrid boards with embedded planes2025
Molded silicon interconnects in bridges for integrated-circuit packages2025
Multi-chip package with recessed memory2025
Molded interconnects in bridges for integrated-circuit packages2024
Composite bridge die-to-die interconnects for integrated-circuit packages2024
Micro through-silicon via for transistor density scaling2024
Micro through-silicon via for transistor density scaling2024