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Home › Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

US Patent 9437538 · Granted Sep 6, 2016

Assignee

Stats Chippac

Inventors

Reza A. Pagaila (192 patents)
Yaojian Lin (300 patents)
Jun Mo Koo (43 patents)

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