Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip-embedded packages with backside die connection

Chip-embedded packages with backside die connection

US Patent 9437516 · Granted Sep 6, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor packages including a package body with grooves formed therein2025
Multi-chip device with gate redistribution structure2025
Device including semiconductor chips and method for producing such device2025
Semiconductor package and method of manufacturing a semiconductor package2025
Method for fabricating a semiconductor device package comprising a pin in the fo2025
Semiconductor apparatuses with radio-frequency line elements, and associated man2025
Package with load terminals on which coupled power component and logic component2025
Cryostat socket for holding an ion trap device mounted on a substrate in a cryos2025
Cryostat socket for holding an ion trap device mounted on a substrate in a cryos2025
Semiconductor package2025
Semiconductor device arrangement with compressible adhesive2025
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on2025