Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming chip with through silicon via electrode

Method of forming chip with through silicon via electrode

US Patent 9437491 · Granted Sep 6, 2016

Estimated economic value: $846,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Passivation scheme for pad openings and trenches2025
Optical sensor mechanism capable of mitigating signal nonlinearity2025
Heat dissipating features for laser drilling process2025
Image sensor and manufacturing method thereof2025
Low warpage high density trench capacitor2025
Image sensor and manufacturing method thereof2025
Structure of semiconductor device2024
Semiconductor device package having metal thermal interface material2024
Switch and scheduling method for packet forwarding of the same2024
Semiconductor arrangement and method of making2024
Semiconductor structure2024
Capacitor structure and method for manufacturing the same2024