Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Silicon shield for package stress sensitive devices

Silicon shield for package stress sensitive devices

US Patent 9355968 · Granted May 31, 2016

Estimated economic value: $11,155,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming the same2025
Heterogeneous bonding structure and method forming same2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Bump structure and method of manufacturing bump structure2025
Software defined manufacturing in a cellular network2025
Chip structure and method for forming the same2025
Redistribution lines having nano columns and method forming same2025
Package bonding structures and method of formation2025
Redistribution lines with protection layers and method forming same2025
Bump structure and method of making the same2025
Package structure2025
Semiconductor device with inductive component and method of forming2025