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Home › Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

US Patent 9318441 · Granted Apr 19, 2016

Assignee

Stats Chippac

Inventors

Reza A. Pagaila (192 patents)
Yaojian Lin (300 patents)
Jun Mo Koo (43 patents)

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