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Home › Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die

US Patent 9263301 · Granted Feb 16, 2016

Assignee

No assignee recorded.

Inventors

Reza A. Pagaila (192 patents)
Yaojian Lin (300 patents)
Jun Mo Koo (43 patents)

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