Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuits and methods of forming integrated circuits with interlayer dielectric protection

Integrated circuits and methods of forming integrated circuits with interlayer dielectric protection

US Patent 9123783 · Granted Sep 1, 2015

Estimated economic value: $963,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Data presentation method and terminal device2025
Image rendering method and related apparatus2025
Memory management method for improving the utilization rate, memory storage devi2025
Vulnerable road user's adversarial behavior opportunity and capability2025
Method of preparing high-performance green building material based on combustion2025
Semiconductor device having interleaved clock gate blocks and decoupling capacit2025
Responses to vulnerable road user's adversarial behavior2025
Method for measuring beam divergence angle of high-current particle beam based o2025
Adaptive side blind zone alert system and method2025
Structure and method for testing of PIC with an upturned mirror2025
System for movement outside of sensor field of view by an autonomous mobile devi2025
Processing method and device2025