Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaged semiconductor devices and methods of their fabrication

Packaged semiconductor devices and methods of their fabrication

US Patent 9099567 · Granted Aug 4, 2015

Estimated economic value: $5,976,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of fabricating substrates with thermal vias and sinter-bonded thermal di2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Low-stress thermal interface2025
Low-stress thermal interface2025
Power amplifier modules, systems, and substrates containing field trapper struct2025
Surface-mount amplifier devices2024
Thick-silver layer interface2024
Thick-silver layer interface2024
Radio frequency packages containing multilevel power substrates and associated f2024
Thermal interface structures, electrical systems with thermal interface structur2024
Hybrid device assemblies and method of fabrication2024
Power amplifier modules including topside cooling interfaces and methods for the2024