Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

US Patent 9066433 · Granted Jun 23, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Inductor and method for manufacturing inductor2025
Copper-ceramic bonded body, insulated circuit board, method for producing copper2025
Vehicle front body structure2025
Pure copper plate2025
Management system, management device, management method, and program2025
Copper alloy, plastically worked copper alloy material, component for electronic2025
Copper alloy, plastically worked copper alloy material, component for electronic2025
Solid-state imaging apparatus and electronic apparatus2025
Layer-to-layer registration measurement mark2025
Pure copper plate2025
Pure copper material, insulating substrate, and electronic device2025
Slit copper material, part for electric/electronic device, bus bar, heat dissipa2025