Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for processing a semiconductor wafer

Methods for processing a semiconductor wafer

US Patent 9059273 · Granted Jun 16, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor surface smoothing and semiconductor arrangement2022
Component and method of manufacturing a component using an ultrathin carrier2022
Silicon carbide devices and methods for manufacturing the same2022
Silicon carbide devices and methods for manufacturing the same2022
Methods of forming a silicon-insulator layer and semiconductor device having the2021
Method of processing a silicon carbide containing crystalline substrate, silicon2021
Method of processing a silicon carbide containing crystalline substrate, silicon2021
Semiconductor devices including a metal silicide layer and methods for manufactu2021
Semiconductor devices including a metal silicide layer and methods for manufactu2021
Integrated circuit substrate and method for manufacturing the same2020
Integrated circuit substrate and method for manufacturing the same2020
Magnetic phase change material for heat dissipation2020