Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

US Patent 8785332 · Granted Jul 22, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Non-invasive IED estimation for pulsed-DC and low frequency applications2025
Method and apparatus for plasma dicing a semi-conductor wafer2025
Method and apparatus for plasma dicing a semi-conductor wafer2025
Method and apparatus for plasma dicing a semi-conductor wafer2025
Method and apparatus for plasma dicing a semi-conductor wafer2025
Shielded gate trench power MOSFET with high-k shield dielectric2025
Electrostatic discharge prevention in ion beam system2025
Fan-out wafer level packaging of semiconductor devices2025
Method of separating electronic devices having a back layer and apparatus2025
Monolithic semiconductor device assemblies2024
Semiconductor devices with dissimlar materials and methods2024
Method of reducing residual contamination in singulated semiconductor die2024