Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flexible substrate with crimping interconnection

Flexible substrate with crimping interconnection

US Patent 8698288 · Granted Apr 15, 2014

Estimated economic value: $9,137,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit modules with encapsulant-embedded leadframe terminals, and methods of fa2025
Conduit inserts for encapsulant compound formulation kneading and encapsulation 2025
Conduit inserts for encapsulant compound formulation kneading and encapsulation 2023
Semiconductor device under bump structure and method therefor2023
Circuit modules with front-side interposer terminals and through-module thermal 2023
Semiconductor device with bond wire reinforcement structure2021
Apparatus and methods for multi-die packaging2019
Substrate interconnections for packaged semiconductor device2018
Packaged semiconductor device having bent leads and method for forming2018
Integrated circuit package having two substrates2017
Semiconductor sensor with gel filled cavity2016
Integrated circuit with sewn interconnects2016