Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrical interconnect for die stacked in zig-zag configuration

Electrical interconnect for die stacked in zig-zag configuration

US Patent 8680687 · Granted Mar 25, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package-on-package assembly with wire bond vias2025
Package-on-package assembly with wire bond vias2023
Package-on-package assembly with wire bond vias2021
Pressing of wire bond wire tips to provide bent-over tips2020
Pressing of wire bond wire tips to provide bent-over tips2020
Package-on-package assembly with wire bond vias2020
BVA interposer2019
Wire bond support structure and microelectronic package including wire bonds the2018
Off substrate kinking of bond wire2018
Pressing of wire bond wire tips to provide bent-over tips2018
Pressing of wire bond wire tips to provide bent-over tips2018
Semiconductor die mount by conformal die coating2017