Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multichip packaging for imaging system

Multichip packaging for imaging system

US Patent 8653467 · Granted Feb 18, 2014

Estimated economic value: $5,127,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mosaic focal plane array2025
Interface circuit for photodetectors providing full-frame integration and pixel-2025
Interface circuit for photodetectors providing full-frame integration and pixel-2024
Bias circuit with improved noise performance2024
Imager with integrated asynchronous laser pulse detection having a signal compon2023
Digital pixel having high sensitivity and dynamic range2022
Per-pixel dark reference bolometer2019
Method of stress relief in anti-reflective coated cap wafers for wafer level pac2019
Method of stress relief in anti-reflective coated cap wafers for wafer level pac2019
Infrared scene projector with per-pixel spectral and polarisation capability2019
Wafer level package solder barrier used as vacuum getter2019
Wafer level package solder barrier used as vacuum getter2019