Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

US Patent 8592926 · Granted Nov 26, 2013

Estimated economic value: $4,132,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Forming a eutectic bond between a wafer having an anti-stiction coating and a ca2019
Rough MEMS surface2018
Method for selective etching using dry film photoresist2018
Reducing MEMS stiction by deposition of nanoclusters2017
Etch release residue removal using anhydrous solution2017
Bonded wafer structure having cavities with low pressure and method for forming2017
Reducing MEMS stiction by increasing surface roughness2017
Reducing MEMS stiction by introduction of a carbon barrier2016
Method of making a MEMS die having a MEMS device on a suspended structure2016
Systems and methods for anchoring components in MEMS semiconductor devices2016
Reducing MEMS stiction by deposition of nanoclusters2016
Glass frit wafer bond protective structure2016